Today, the Intel Foundry Technology Research team announced technology breakthroughs in transistor, interconnects, and packaging technology, among others, which it will unveil in seven of its own papers, along with two more papers in collaboration with...
Arctic's new S12038-4K/8K server fans have an extra set of fan blades for the true cooling enjoyers. Really, the extra blades are to cool its own center shaft, which may be necessary based on the fan's class-leading performance.
Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 HBM modules.
