Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 HBM modules.
Microsoft Flight Simulator has been the quintessential CPU gaming benchmark for a while, and the 2024 release mostly keeps that pattern. Maxed-out settings tend to be more core-friendly than the prior release, and you'll still want a potent GPU for hig...
The primary weakness of the new export rules lies in their reliance on a fab-specific approach instead of an entity-wide strategy, asserts John Moolenaar, the chairman of House Select Committee on the CCP.
